TAMPA, Fla. — As semiconductor devices continue to become smaller and more complex, accurate thin-film metrology plays an increasingly important role in wafer process development and advanced device manufacturing. Engineers developing next-generation semiconductor technologies require precise thin-film thickness measurements while maintaining the flexibility to adapt measurement workflows as new materials, deposition processes, and fabrication techniques continue to evolve.

To support these growing requirements, StellarNet has expanded its thin-film metrology portfolio with the introduction of the TF-Micro™Thin-Film Measurement Microscope, a modular microscope-based system designed for precision thin-film thickness measurements. Built on StellarNet’s modular instrumentation philosophy, the TF-Micro system allows laboratories to configure the capabilities they need today while providing a straightforward path for future expansion.

Researchers and process engineers interested in semiconductor film characterization can learn more about Semiconductor Thin-Film Measurement Systems by visiting:
https://www.stellarnet.us/systems/thin-film-metrology/semiconductor-measurement/

The TF-Micro system combines high-resolution microscope imaging with StellarNet’s Thin-Film Metrology software to deliver accurate thin-film thickness measurements. Laboratories can enhance the system over time with TF-AM™Automated Mapping and Surface Quality Verification™, allowing the same instrument to support increasingly sophisticated metrology workflows without replacing the core system.

TF-AM™ Automated Mapping enhances the TF-Micro system by automating precision thin-film thickness measurements across user-defined grids, lines, and regions of interest. Instead of manually repositioning the sample for every measurement, engineers can automatically generate detailed thin-film thickness maps while recording:

Automated mapping improves repeatability, increases measurement throughput, and provides greater insight into film uniformity, deposition consistency, and process variation.

 

Surface Quality Verification ™ integrates microscope imaging directly into the measurement workflow, allowing users to visually verify and document each measurement location before collecting spectral data. The imaging workflow assists users in identifying visible surface conditions that may influence measurement quality, including:

By documenting the measurement area before analysis, researchers can improve confidence in their measurements while maintaining a permanent visual record of every analyzed location.