Photonic Device Measurement
Need a photonic device measurement solution? Our configurable thin film metrology systems deliver rapid, non-contact optical measurements for photonics research, process development, manufacturing, quality control, and improved production consistency. Speak with our team to configure a system for your application.
StellarNet Photonic Device Measurement Systems combine reflectance and transmission spectroscopy with modular optical measurement platforms to characterize optical coatings, waveguides, photonic integrated circuits (PICs), optical filters, laser components, and quantum photonic devices. Designed for applications ranging from silicon photonics and optical communications to LiDAR and advanced laser systems, these flexible solutions provide accurate optical characterization to optimize light propagation, transmission, reflection, device performance, and next-generation photonic technologies.
Common Photonic Thin Films & Devices
Modern photonic devices rely on precision thin films and optical coatings to control light propagation, wavelength response, reflection, transmission, and overall device performance. Accurate optical characterization of these films is essential for photonics research, device development, and manufacturing quality control.
- Silicon Photonics – Integrated Optical Circuits & Waveguides
- Photonic Integrated Circuits (PICs) – Optical Computing & Communications
- Optical Waveguides – Light Propagation & Signal Routing
- Optical Filters – Wavelength Selection & Spectral Control
- Dielectric Mirrors – High-Reflectivity Laser & Optical Systems
- Beam Splitters – Precision Optical Power Distribution
- Laser Components – Optical Cavities, Facets & Thin Film Coatings
- Quantum Photonic Devices – Integrated Quantum Optics & Quantum Communications
Cross-sectional silicon nitride (Si₃N₄) optical waveguide film stack illustrating silicon nitride core, silicon dioxide (SiO₂) cladding, and silicon substrate for thin film metrology, optical characterization, and silicon photonics.
Key Photonic Device Measurements
Accurate photonic device measurement requires more than determining thin film thickness alone. Engineers evaluate multiple optical and material properties to optimize light propagation, minimize optical loss, improve wavelength selectivity, and ensure consistent device performance across silicon photonics, photonic integrated circuits (PICs), laser optics, optical filters, and quantum photonic devices.
Typical photonic device measurements include:
- Thin Film Thickness
- Reflectance
- Transmission
- Optical Loss
- Wavelength Response
- Optical Constants (n & k)
- Optical Filter Characterization
- Waveguide & Photonic Device Characterization
- Process Monitoring & Manufacturing Quality Control
Photonic device manufacturing workflow illustrating silicon photonics fabrication, epitaxial layer growth, dielectric thin film deposition, photolithography, optical waveguide formation, metal contacts, passivation, optical coatings, wafer testing, device packaging, and optical characterization using StellarNet thin film metrology systems.
Applications for Photonic Device Measurement
Silicon Nitride Waveguide Thickness Measurement (Silicon Photonics & PICs)
Silicon nitride (Si₃N₄) waveguides are a foundational technology for silicon photonic integrated circuits (PICs), enabling low-loss optical routing for telecommunications, LiDAR, biosensing, quantum photonics, and integrated optical sensors. The waveguide thickness directly influences optical confinement, propagation loss, coupling efficiency, and overall device performance. Spectroscopic reflectometry provides fast, non-contact thickness measurement of silicon nitride waveguide layers deposited on silicon dioxide and silicon substrates, supporting process development, wafer qualification, and high-volume PIC manufacturing.
Typical Recipe
- Air
- Si₃N₄ (400 nm)
- SiO₂ BOX/Cladding (3000 nm)
- Silicon (Bulk)
Recommended Spectrometer: 500–1700 nm (TF-VIS-NIR)
TF-VIS-NIR thin film analysis system measuring a silicon photonics waveguide stack consisting of silicon nitride (Si₃N₄) on silicon dioxide (SiO₂) over a silicon substrate using optical reflectance spectroscopy for thin film thickness measurement, optical modeling, silicon photonics, and photonic integrated circuit (PIC) characterization.
Broadband Anti-Reflection Coating Thickness Measurement (Lasers & Optical Components)
Broadband anti-reflection (AR) coatings reduce optical losses by minimizing surface reflections over a wide wavelength range. These multilayer dielectric coatings are widely used on laser optics, imaging lenses, optical windows, fiber optic components, spectrometers, microscopes, and scientific instruments. Precise control of each coating layer is essential for achieving high transmission and low reflectance. Spectroscopic reflectometry combined with Transfer Matrix Method (TMM) analysis provides accurate, nondestructive thickness measurement of multilayer optical coatings throughout manufacturing and quality control.
Typical Recipe
- Air
- SiO₂ (110 nm)
- Ta₂O₅ (72 nm)
- Fused Silica (Bulk)
Recommended Spectrometer: 350–1000 nm (TF-UVIS)
StellarNet Thin Film System (TF-UVIS) analyzing a multilayer SiO₂/Ta₂O₅ dielectric optical coating on fused silica for film thickness measurement, optical modeling, and laser component characterization.
ITO Current Spreading Layer Thickness Measurement (LEDs & Photonic Devices)
Indium Tin Oxide (ITO) current spreading layers are commonly used in GaN-based LEDs and other photonic devices to distribute electrical current uniformly while maintaining high optical transparency. Uniform ITO thickness is critical for maximizing light output, improving electrical efficiency, enhancing brightness uniformity, and ensuring long-term device reliability. Spectroscopic reflectometry provides rapid, non-contact measurement of transparent conductive coatings deposited on GaN and sapphire substrates, making it well suited for LED process development, photonic device manufacturing, and production quality control.
Typical Measured Stack
Air
ITO (150 nm)
GaN (~2 µm)
Sapphire Substrate
Recommended Thin Film System: 400–1000 nm (TF-VIS)
StellarNet Thin Film Measurement System (TF-VIS) measuring an indium tin oxide (ITO) current spreading layer on gallium nitride (GaN) and sapphire using optical reflectance spectroscopy for thin film thickness measurement, optical modeling, LED manufacturing, MicroLEDs, VCSELs, and photonic device characterization.
Silicon Nitride Ring Resonator Thickness Measurement (Quantum Photonics)
Silicon nitride ring resonators are fundamental building blocks for quantum photonic integrated circuits, optical frequency combs, quantum sensing, nonlinear optics, and precision metrology. Waveguide thickness directly affects resonance wavelength, quality factor (Q), optical confinement, and device performance. Spectroscopic reflectometry provides accurate, nondestructive thickness measurement of silicon nitride resonator structures deposited on silicon dioxide and silicon substrates, enabling precise fabrication control for research and commercial quantum photonic devices.
Typical Recipe
- Air
- Si₃N₄ (350 nm)
- SiO₂ (2000 nm)
- Silicon (Bulk)
Recommended Spectrometer: 500–1700 nm (TF-VIS-NIR)
Silicon nitride (Si₃N₄) ring resonator measured using a StellarNet Thin Film Measurement System (TF-VIS-NIR) with optical reflectance spectroscopy to characterize a silicon nitride waveguide on silicon dioxide (SiO₂) over a silicon substrate for thin film thickness measurement, optical modeling, quantum photonics, silicon photonics, and photonic integrated circuit (PIC) development.
MEMS Optical Mirror Thickness Measurement (MEMS & MOEMS)
Optical MEMS mirrors are widely used in LiDAR systems, optical switching, barcode scanners, pico projectors, biomedical imaging, and adaptive optics. These devices typically incorporate reflective aluminum coatings deposited over dielectric layers to maximize reflectivity while maintaining precise mechanical performance. Accurate thin film thickness measurement ensures consistent optical reflectance, mirror flatness, and device reliability. Spectroscopic reflectometry offers a rapid, non-contact solution for characterizing reflective and dielectric layers used in MEMS and MOEMS manufacturing.
Typical Recipe
- Air
- Aluminum (80 nm)
- Si₃N₄ (250 nm)
- Silicon (Bulk)
Recommended Spectrometer: 350–900 nm (TF-UVVIS)
DWDM Thin Film Filter Thickness Measurement (Optical Communications)
Dense Wavelength Division Multiplexing (DWDM) filters are precision multilayer dielectric optical filters used in fiber optic communication systems to separate and combine closely spaced optical wavelengths around the telecom bands. The optical performance of these filters depends on precise control of each dielectric layer thickness, often to sub-nanometer accuracy. Spectroscopic reflectometry combined with TMM modeling provides rapid, non-contact measurement of multilayer optical filter stacks, supporting manufacturing of DWDM, CWDM, optical transceivers, and high-speed communication components.
Typical Recipe
- Air
- Multilayer Dielectric Stack (Ta₂O₅ / SiO₂)
- Optical Glass (Bulk)
Recommended Spectrometer: 1200–1700 nm (TF-NIR)
StellarNet Recommended Thin Film Metrology Systems for Photonic Devices
Every photonic device has unique measurement requirements based on material composition, optical coatings, wavelength range, and device architecture. StellarNet’s modular thin film metrology platform allows users to configure complete measurement systems using UV-VIS spectrometers, reflectance and transmission fixtures, stabilized light sources, fiber optic probes, and advanced thin film analysis software.
From silicon photonics and optical waveguides to optical filters, laser components, dielectric coatings, and photonic integrated circuits, our flexible systems support research, process development, photonic device characterization, and production quality control. Our engineer-owned team works directly with customers to configure reliable, non-contact measurement solutions tailored to their photonic applications.
StellarNet TF™ Systems
StellarNet TF™ Systems combine reflectance spectroscopy, precision optics, and intuitive StellarPro™-TFC, Thin-Film Metrology software, to deliver accurate, non-destructive film thickness measurements from approximately 1 nm to 300 µm. The modular architecture allows laboratories to configure the ideal system today while providing a straightforward upgrade path for future automation and advanced measurement capabilities.
TF-Micro™
TF-Micro™ upgrades any compatible StellarNet TF™ System with a high-resolution microscope, enabling precision thin-film thickness measurements of microscopic features and small sample areas.
TF-Micro-AM
TF-Micro-AM™ adds programmable XY automation to compatible StellarNet TF™ Systems and TF-Micro™, enabling automated thickness mapping, repeatable positioning, and comprehensive measurement documentation for research and process development applications.
Thin Film Measurement Systems
| System | Range (nm) | Resolution | Thickness | Lamp type | Price |
|---|---|---|---|---|---|
TF-VIS | 400-1000 | <2nm | 10nm-75um | Visible/NIR | $11,500 |
| TF-UVVIS | 200-1100 | <2.5nm | 1nm-75um | UV + Visible/NIR | $14,625 |
| TF-NIR | 900-1700 | <5nm | 100nm-300um | Visible/NIR | $22,655 |
| TF-VIS-NIR | 400-1700 | <2nm, 5nm>1000nm | 10nm-300um | Visible/NIR | $25,280 |
| TF-UVVIS-NIR | 200-1700 | <2nm, 5nm>1000nm | 1nm-300um | UV + Visible/NIR | $28,245 |
| TF-Micro | StellarNet configured Microscope equipped with 4,10, & 40x objectives, CMOS 1.3 Mpixel Camera, optical switch, and required coupling accessories | $11,550.00 |
| TF-Micro-AM | StellarNet configured Auto-Mapping Microscope equipped with 4,10, & 40x objectives, CMOS 1.3 Mpixel Camera, optical switch, and required coupling accessories | $30,975.00 |
Thin Film System Specifications
| Precision | 0.1Å or 0.01% (greater of) |
| Accuracy | 0.2% or 10A (greater of) Film stack dependent |
| Stability | 0.2A or 0.02% (greater of) |
| Spot size | 3mm standard, optional down to 3 µm |
| Sample size | Sample size from 1 mm |
| Computer OS | StellarPro-TFC Software designed for 32 and 64-bit OS |
Technical Information Request
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